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Digital Library / STP / STP1413-EB
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STP1413
Mechanical Properties of Structural Films
Muhlstein CL, Brown SB
Pages: 334
Published: 2001
Format: PDF (7.7M)
Price: $110 [Download Now]
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Written by an international group of experts from six countries. STP 1413 is one of the most complete assemblies of papers on the characterization of the mechanical properties of structural films available to date. In the rapidly developing field of structural films, this new ASTM publication is a milestone in the engineering of these materials systems and their characterization. 22 papers cover four major areas of structural films characterization: • Fracture and Fatigue • Elastic Behavior and Residual Stress • Tensile Testing • Thermomechanical, Wear, and Radiation Damage
Table of Contents
Surface Topology and Fatigue in Si MEMS Structures
Allameh S., Gally B., Brown S., Soboyejo W.
Cross Comparison of Direct Strength Testing Techniques on Polysilicon Films
LaVan D., Tsuchiya T., Coles G., Knauss W., Chasiotis I., Read D.
Fatigue and Fracture in Membranes for MEMS Power Generation
Bahr D., Crozier B., Richards C., Richards R.
Effects of Microstructure on the Strength and Fracture Toughness of Polysilicon: A Wafer Level Testing Approach
Ballarini R., Kahn H., Tayebi N., Heuer A.
Fatigue Crack Growth of a Ni-P Amorphous Alloy Thin Film
Takashima K., Shimojo M., Higo Y., Swain M.
Direct Tension and Fracture Toughness Testing Using the Lateral Force Capabilities of a Nanomechanical Test System
LaVan D., Jackson K., McKenzie B., Glass S., Friedmann T., Sullivan J., Buchheit T.
Fracture Behavior of Micro-Sized Specimens with Fatigue Pre-Crack Prepared from a Ni-P Amorphous Alloy Thin Film
Takashima K., Shimojo M., Higo Y., Swain M.
Integrated Platform for Testing MEMS Mechanical Properties at the Wafer Scale by the IMaP Methodology
de Boer M., Smith N., Masters N., Sinclair M., Pryputniewicz E.
Influence of the Film Thickness on Texture, Residual Stresses and Cracking Behavior of PVD Tungsten Coatings Deposited on a Ductile Substrate
Ganne T., Farges G., Crépin J., Pradeilles-Duval R., Zaoui A.
High Accuracy Measurement of Elastic Constants of Thin Films by Surface Brillouin Scattering
Beghi M., Bottani C., Pastorelli R.
Effect of Nitrogen Feedgas Addition on the Mechanical Properties of Nano-Structured Carbon Coatings
Catledge S., Vohra Y.
Characterization of the Young's Modulus of CMOS Thin Films
Hossain N., Ju J., Warneke B., Pister K.
Derivation of Elastic Properties of Thin Films from Measured Acoustic Velocities
Pastorelli R., Tarantola S., Beghi M., Bottani C., Saltelli A.
Side-by-Side Comparison of Passive MEMS Strain Test Structures under Residual Compression
Masters N., de Boer M., Jensen B., Baker M., Koester D.
Mechanical Tests of Free-Standing Aluminum Microbeams for MEMS Application
Zhang P., Lee H., Bravman J.
Tensile Testing of Thin Films Using Electrostatic Force Grip
Tsuchiya T., Sakata J.
Tensile Tests of Various Thin Films
Sharpe W., Jackson K., Coles G., Eby M., Edwards R.
Ductile Thin Foils of Ni3Al
Demura M., Kishida K., Umezawa O., George E., Hirano T.
Microstructural and Mechanical Characterization of Electrodeposited Gold Films4
Long G., Read D., McColskey J., Crago K.
Determining the Strength of Brittle Thin Films for MEMS
Johnson G., Jones P., Wu M., Honda T.
Thermomechanical Characterization of Nickel-Titanium Copper Shape Memory Alloy Films
Seward K., Ramsey P., Krulevitch P.
Deformation and Stability of Gold/Polysilicon Layered MEMS Plate Structures Subjected to Thermal Loading
Dunn M., Zhang Y., Bright V.
The Effects of Radiation on the Mechanical Properties of Polysilicon and Polydiamond Thin Films
Newton R., Davidson J.
Author Index
Subject Index
Committee: E08
Paper ID: STP1413-EB
DOI: 10.1520/STP1413-EB
ISBN-EB: 978-0-8031-5458-2
 ASTM International is a member of CrossRef.
0-8031-2889-4
978-0-8031-2889-7
STP1413-EB
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