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Digital Library / STP / STP189-EB
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STP189
Symposium on Solder
Committee B-2
Pages: 195
Published: 1957
Format: PDF (4.6M)
Price: $60 [Download Now]
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Table of Contents
Introduction
Gonser B.
Solders, Fluxes, and Techniques for Soldering Aluminum
Dowd J.
Ultrasonic Soldering of Aluminum
Jones J., Thomas J.
Dip Soldering Printed Circuits
Miller E., Johns A.
Soldering in Semiconductor Devices
Lootens W.
Industrial Survey of Paste Solder Alloys
Williams H.
Corrosive Fluxes—Their Role in Soldering
MacIntosh R.
The Use of Rosin and Activated Rosin Fluxes
Disque F.
Soldering Fluxes and Flux Principles
Mample A.
Non-Corrosive Fluxes—Evaluation of Spread and Corrosion Properties
Sohl H.
A Method for Testing and Evaluating the Joint Properties of a Copper Liner Soldered in an Aluminum Casting
Davis M.
The Performance of Some Soft Solders at Elevated Temperatures and Pressures
Pattee H., Evans R.
Dip-Soldered Printed Circuit Joint Characteristics
Johns A., Miller E.
“Tin Disease” in Solder Type Alloys
Bornemann A.
Gray Tin Formation in Soldered Joints Stored at Low Temperature
Williams W.
Proposed Numerical Evaluation System for Soft Solders, Solder Fluxes, and Solderability
Pessel L.
Controlling Quality on Soldered Electrical Connections
Rombach W.
Symposium Summation
Harnden G.
Committee: B02
Paper ID: STP189-EB
DOI: 10.1520/STP189-EB
ISBN-EB: 978-0-8031-5938-9
 ASTM International is a member of CrossRef.
0-8031-6092-5
978-0-8031-6092-7
STP189-EB
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