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STP319
Papers on Soldering (1962)

Committee B-2
Pages: 99
Published: 1963
Format: PDF (5.4M)
Price: $55  [Download Now]



Table of Contents

Introduction
White P.

Printed Wiring Surface Preparation Methods—Elimination of Gold Plating as a Surface Preparation for Printed Circuits and Development of a Contamination-Free Surface
Keller J.

Embrittlement of Solder by Gold from Plated Surfaces
Foster F.

Mechanism of Wetting During Solder Joint Formation
Manko H.

Effect of Impurities on Some Properties of Lead-Tin Alloys
Heberlein M.

Factors Affecting Quality of Soft Soldered Joints in Copper Water Tube
Keyes J.

Tin Transformation Of Tinned Copper Wire
Spergel J.

Committee: B02
Paper ID: STP319-EB
DOI: 10.1520/STP319-EB
ISBN-EB: 978-0-8031-6721-6

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0-8031-6597-8
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STP319-EB